As a central facility of the Institute, the Nanostructuring Lab offers tools and equipment for sample processing and characterization under cleanroom conditions. These are usually operated by the NSL users – after being trained - on their own.
Requesting Access to NSL Service:
• Application form for MPI-FKF contract holders (pdf)
• Application form for MPI-FKF externals (University, MPI-IS, ...) (pdf)
The application form - filled by the applicant and the department director/university professor – should be passed in to the NSL team. Together with the NSL team, the further steps will be discussed.
Any requests or questions?
Please contact the NSL team via nsl_team@fkf.mpg.de.
– 100 kV Electron Beam Writer (JEOL JBX6300FS) under Stable Environmental
Conditions (Magnetic Field, Temperature, Humidity)
– SEM-based Electron Beam Writer with Interferometer-controlled Sample Stage
(Raith eLine, Raith eLine plus)
– Proximity Corrections for Electron Beam Lithography (Genisys Beamer)
– Mask Design
– Mask Aligner for Exposure (Karl Suess MA 6 and MJB 3)
– Direct Laser Writer (Kloé Dilase 250)
– Diverse Positive- and Negative-tone Resists are available
Scanning Electron Microscope Combined with Focused Ion Beam, Micromanipulators and Gas Injection (Zeiss Crossbeam)
– TEM Lamella Preparation
– Shaping of Functional Devices from Micro-crystals
– Positioning of (Sub-)Micron Sized Objects
– Cryo-Stage (-150 °C to 400 °C) (Kammrath & Weiss)
– Photo Camera Setups (Nikon)
– Stereo Microscopes (Nikon)
– Optical Microscopes (Nikon)
– Digital Microscopes (Olympus), also in Ar-Glovebox
Scanning Electron Microscopes (Zeiss Merlin, Zeiss Gemini SEM 500) with
– EDX, EBSD (Oxford Instruments)
– EBIC
– in-situ Scanning Probe Microscopy (Semilab)
– Micromanipulation Tools (Kleindiek)
– Sample Loading from Vacuum Shuttle
– Cryo-Stage (-150 °C to 400 °C) (Kammrath & Weiss)
– ICP-RIE with Fluorine, Chlorine, and Bromine Chemistry
(Oxford Instruments PlasmaPro 100 Cobra)
(Sentech SI 500 with Option of Sample Loading from Ar-Glovebox)
– Bosch-like Etching Process
– Water-based Atomic Layer Deposition (Ti-, Hf-, Al-oxides)
(Cambridge Nanotechnology Shavanna 100)
– Plasma-enhanced Atomic Layer Deposition (PE-ALD) (Oxide, Nitride, Sulfide, Metal)
(Sentech ALD with Real-time Monitoring)
– ICP-RIE and PE-ALD within one Vacuum Cluster for Surface Treatment /
Passivation / Encapsulation / Electrical Isolation (Sentech)
– Various Chemical Working Places for Spin Coating, Resist Developing,
Wet Etching, Lift-Off, Sample Cleaning, Exfoliation, …
– Chemical Fume Hood with Ultrasound Bath for Cleaning Large UHV Parts
– Sample and Substrate Cleaning in Megasound Bath
– Thin Film Sputtering (Leica ACE600)
– Thermal Evaporation (Leybold Univex Systems)
– Thermal Atomic Layer Deposition (Cambridge Nanotechnology Shavanna 100)
– UHV Aluminum Deposition with Controlled in-situ Oxidation
– Exfoliation of 2D Material Flakes
– Wire Bonding (Wedge and Glue Bonding)
– GHz Plasma Cleaner (Diener)
– Annealing Oven (Dr. Eberl-MBE-Komponenten)
– Pyrolytic Cleaning Oven
– Critical Point Dryer (Leica EM CPD300)
– Target Preparation Tool for Milling, Sawing, Grinding and Polishing Samples
(Leica EM TPX)
– Cross Section Polisher (JEOL IB-091010CP)
– Diamond Scratcher for Separating Chips from a Wafer (Karl Suess)
– Diamond Wire Saw (Well 3242)
– Argon Ion Polisher (Gatan Model 683)
– Profilometer (Veeco Dektak 8)
– Ellipsometer (Sentech SENResearch)
– Needle Probe Station
– Vacuum Scanning Probe Microscope (AFM/STM) with Load-Lock for Sample and
Tip Exchange (Semilab)
– Argon Gloveboxes (with Automated High-end Optical Microscope Olympus DSX510)
– Vacuum Shuttle Connection (Vacuum-connected Network of SEM, FIB, Material
Sputtering)
– Plasma-enhanced Reactive Ion Etching and Atomic Layer Deposition with Sample
Loading from Ar-Glovebox
– Monte-Carlo-Simulation of Electron Scattering in Materials
– Proximity Corrections for Electron Beam Lithography (Genisys Beamer)
– 3D Data Analysis and Visualization (Avizo)
